In depth analysis of the development status of board to board connectors
At present, the board to board connectors used in mobile phones mainly have the following characteristics:
The first is "flexible", flexible connection, and has a strong corrosion resistance; the second is no welding, convenient installation, and will not produce fire hazards, which also saves space; but today's plate to plate are ultra-low height, two pieces, which will be discussed in the following section; Finally, it has strong environmental resistance, not only flexible, but also uses "solid connection" with high contact reliability; of course, it also has the advantages of unlimited pipe, sealing under pressure, convenient installation and so on.
In order to improve the combination force of the socket and the plug, a simple lock mechanism is adopted in the fixed metal part and the contact part, so as to improve the combination force and make the locking more practical. The connector can minimize the thickness of the product to achieve the purpose of connection, which leads to more and more ultra-thin mobile phones on the market!
At present, 0.35mm pitch is mainly used in Apple mobile phones and domestic high-end models. Its application will be the general trend in the past two years. It has the advantages of the least volume, the highest precision and high performance. However, it has higher requirements for patch and other supporting processes. This is where many connector manufacturers need customer service most. Otherwise, the yield will be very low.
Today, consumers have higher and higher requirements for product thickness and hand experience. The ultra-thin and ultra narrow connectors put forward new requirements for the electroplating process, Single product less than 0.4 Mm high products, how to ensure that the thickness of gold plating and the effect of tin coating do not climb tin, has become the most critical problem of connector miniaturization. At present, the common practice in the industry is to block the path of tin coating by stripping the gold coating with laser, so as to solve the problem of no climbing tin. But this technology has a disadvantage, that is, when stripping gold, the laser will also damage the nickel coating, so that the copper is exposed to the air And then corrosion and rust.
One point to be mentioned now is that the board to board connector can be constructed by simple machine circuit design. By setting an insulating wall on the bottom of the connector, the wiring of the PC board can be carried out on the bottom of the connector without contacting with the metal terminal, which is quite beneficial for the miniaturization of the PC board!
